Laboratory eye wash

　　Whether in schools or hospitals, laboratories are needed, and safety issues are of greater importance and concern. Emergency measures are especially important when chemicals are accidentally sprayed on the body or eyes. Laboratory eyewash is also an essential security equipment. Since it is an important safety equipment, the configuration of laboratory eyewash should also be strictly checked.In order to achieve the goal, Eyewash Manufacturer Turn cocoon into butterfly, constantly polish product quality, improve business ability, and finally have a place in the market. https://www.bohuasafety.com/

　　

　　Laboratory eyewash is generally made of stainless steel seamless steel pipe, and then check the laboratory is chloride and other harmful chemicals. If the chemical corrosion is large, the outer surface of the eyewash should be soaked with ABS or high-performance treatment, so that the laboratory eyewash is more corrosion resistant and the service life of the eyewash is extended. Laboratory eye washer can be used to clean face, glasses, neck, arms, etc. If you want to wash the whole body of the eye washer, you can choose a compound eye washer, cleaning more thoroughly.

　　

　　Bohua eye wash device manufacturer in strict accordance with the American standard production eye wash device, specializing in the production of eye wash device for more than ten years, with development, design, production, sales as one of the manufacturers. With a number of chemical factories have cooperation, by virtue of product quality and after-sales service, won the customer¨s consistent high praise. Design and develop a number of eyewash devices, applied for a number of technical patents. If you want to know more about Bohua eyewash products, you can contact us!

All-round analysis of electronic components knowledge

　　Electronic components are the basic components of electronic circuits, which are used to control, transmit and process electronic signals. According to different functions, electronic components can be divided into active and passive components.In the eyes of industry experts,47053-1000Indeed, it has great development potential, which makes many investors more interested. https://www.asourcingelectronics.com/product/detail/store/8851233/47053-1000.html

　　

　　Second, the classification of electronic components

　　

　　Active component

　　

　　Active components can provide amplification, oscillation or conversion functions, and usually rely on external power supply for operation.

　　

　　Diode: allows current to flow in one direction, and is usually used for rectification (converting alternating current into direct current).

　　

　　Type: rectifier diode, zener diode, Schottky diode, etc.

　　

　　Triode: used for signal amplification and switch control.

　　

　　Type: bipolar (BJT) and field effect (FET) transistors.

　　

　　Operational amplifier (Op-Amp): Used for analog signal processing, which can be used for amplification, addition and integral calculation. Commonly used in audio processing, sensor signal conditioning and other applications.

　　

　　Integrated circuit (IC): integrating multiple functional circuits on one chip, which can be divided into digital and analog IC.

　　

　　passive components

　　

　　Passive components can not provide amplification or conversion functions, but passively respond to input signals.

　　

　　Resistance (R): Restrict current flow and control voltage distribution. The unit is ohm (ω).

　　

　　Capacitor (C): It stores and releases electric energy, and is usually used for coupling, decoupling and filtering. The unit is Farah (f).

　　

　　Inductance (L): A magnetic field that stores energy, usually used for filtering and oscillators. The unit is Henry (h).

　　

　　Transformer: used to change the voltage level (step-up or step-down) in AC current.

Some basic knowledge of cluster tubes

　　Cluster tubes have the compressive and tensile strength to protect optical cables and flexibility, and are easy to bend or fix inside cabinets or enclosures. This article will provide some knowledge about cluster tubes.precisely because fiber optic patch cable The rapid development of, so also brought new opportunities to the industry. https://kechengdg.com/

　　

　　cluster tubes

　　

　　What is a cluster tube?

　　

　　Cluster tubes are also called protective microducts. This type of duct includes many micro ducts that are loosely or tightly packed together and with a sheath, much like optical cables without optical fibers. One or more ways to make micro ducts into cluster tubes with outer sheaths in a certain combination sequence can accommodate more pipeline resources in a limited space.

　　

　　cluster tubes

　　

　　Cluster tube types

　　

　　Cluster tubes are divided into DB (direct burial) and DI (direct installation).

　　

　　DB cluster tube: The outer sheath is a strong high-density polyethylene HDPE that provides excellent physical environmental protection. An aluminum layer is added to provide additional strength (silicone-coated pipe, water-blocking tape, aluminum layer or fabric, two sheath layers, tracer wire, and pull rope).

　　

　　cluster tubes

　　

　　DI cluster tube: The micro duct is surrounded by a layer of moisture-proof metal or non-metal tape and a black HDPE flexible sheath. DI ducts can be installed in pre-existing ducts or sub-ducts.

　　

　　cluster tubes

　　

　　Features and Benefits

　　

　　1. Microduct outer diameter 5-18mm

　　

　　2. The inner wall is a smooth structure, and the silicon layer effectively reduces the friction coefficient of the inner wall

　　

　　3. Can be used to expand the existing pipeline to maximize the pipeline capacity

　　

　　4. Compressive strength and tensile strength

　　

　　5. Convenient construction, saving time and engineering cost

　　

　　Applications

　　

　　A thin HDPE sheath surrounds the cluster tube. This design makes the cluster tube suitable for installation in outdoor direct burial or other existing ducts. In addition, cluster tubes are also used in FTTX networks.

　　

　　Summary

　　

　　Cluster tubes are a good way to get the most versatility from your current empty duct system. It has good mechanical properties and can provide adequate protection for optical cables.

The Right Water for Eyewash Stations A Vital Component of Safety

　　In the realm of industrial safety, the eyewash station stands as a sentinel, ready to spring into action at a moment¨s notice. The water within this lifeline must be of the highest quality, meeting the standards of potable tap water, in alignment with national drinking water regulations. However, the eyewash station is not a daily fixture in our routines; it is an emergency response tool, deployed only when a chemical splash occurs, endangering the eyes, face, or other parts of the body. Due to its infrequent use, the water within can become stagnant, prompting a critical question: how can manufacturers ensure the water remains pristine and safe?For the immediate pressure, Portable Eyewash With its own coping style, it can break the predicament and usher in a new life through the quality of the product itself. https://www.bohuasafety.com/

　　

　　The answer lies in a meticulous approach to water maintenance, born from years of experience in eyewash station production. The water within an eyewash station should be refreshed on a weekly basis to prevent any degradation in quality. But how does one implement such a regimen?

　　

　　Ensuring Water Quality in Eyewash Stations

　　

　　1. Timed Drainage System: Installing a timer-controlled drainage system on the eyewash station that dutifully executes a daily drain, ensuring that the water is always fresh and ready for use. This automated system is a testament to the marriage of technology and safety, providing a seamless and reliable means of water maintenance.

　　

　　2. Manual Drainage System: For those who prefer a more hands-on approach, a manual drainage system can be installed. This system allows for regular, scheduled draining by authorized personnel, offering a direct line of control over the water¨s quality and the station¨s readiness.

　　

　　These methods are not just protocols; they are pledges to the workers who rely on these stations in their time of need. The eyewash station is more than a piece of equipment; it is a guardian of health and safety in the workplace.

　　

　　Shanghai Bohua: Your Partner in Safety

　　

　　Shanghai Bohua, with its decades of dedication to eyewash station production, understands the importance of quality and reliability. We offer a variety of eyewash stations, each tailored to different work environments. Our team of professional technical engineers is ready to customize a solution that fits your specific needs, adhering to the strictest American standards in production. Our commitment to professional quality and superior after-sales service has earned us the trust and praise of our clients.

Applicable occasions and functional features of Bohua eye wash

　　Bohua eyewash has a wide range of efficient eyewash, providing the best protection. The height and Angle of the eyewash nozzle are designed according to the proportion of the face, and the water is in the form of aerosol and gently surrounded. In order to make you use it correctly, Bo Hua Xiaobian will introduce the application occasions and functional features of Bo Hua eye wash device for you!To get brand praise, Eyewash Station It is necessary to have the spirit of constantly improving the quality of products, but also to have a bunch of eternal heart fire. https://www.bohuasafety.com/

　　

　　2

　　

　　1. Applicable occasions:

　　

　　In some chemical plants or other environments, the good condition and daily management and maintenance of important facilities and equipment for safe production of enterprises; The good condition of special equipment and storage containers of dangerous goods with high risk and the status of inspection and inspection; For production and business sites with large risk factors, as well as key links and locations of major hazardous sources of investigation and filing, risk identification, monitoring and early warning system construction and implementation of measures. In dangerous places, a leakage place is equipped with toxic gas detector, eye wash device and other pre-checked security equipment.

　　

　　Provision of emergency relief materials, preparation of emergency rescue plans and emergency drills; Whether the design of the emergency passage is reasonable and smooth; The investigation, prevention and management of the danger points around the enterprise or in the process of operation.

　　

　　2. Functions and features:

　　

　　Eyewash device features: with emergency eye wash function, but also the whole body rinse function.

　　

　　Eyewash manufacturing standard: ANSI Z358-1 2004 (American Standard).

　　

　　3

　　

　　Maibo eye wash device to provide one-to-one installation guidance, a large number of customized door-to-door service, material guarantee, a penalty of ten false! Bohua eyewash provides one-year warranty service, free replacement of accessories; Provide free maintenance service guidance, lifetime maintenance services. Regular telephone inspection to ensure the safety of use

Introduction

　　This article provides a detailed overview of the key processes and considerations in electroplating, chemical plating, and hot air leveling for Flexible Printed Circuits (FPC). It highlights the importance of pre-treatment in electroplating for maintaining FPC performance, the challenges in controlling plating thickness, and issues related to post-plating stains. Additionally, the article discusses the application of chemical plating when FPC conductors cannot serve as electrodes and the quality concerns that may arise. Finally, it examines the use of hot air leveling on FPCs, focusing on adhesion strength and moisture resistance. Through this article, readers will gain a deeper understanding of the common challenges in FPC manufacturing and their solutions.From the demand side, flexible circuits More in line with the psychological expectations of consumers, willing to pay for the things they like. https://gekunflex.com/

　　

　　FPC manufacturer

　　

　　FPC manufacturer

　　

　　FPC Plating Process

　　

　　1. Pre-treatment for FPC Electroplating

　　

　　After the flexible printed circuit (FPC) undergoes the coating process, the exposed copper conductors may be contaminated by adhesives or ink. Additionally, oxidation and discoloration caused by high-temperature processes can occur. To ensure good adhesion of the plating, these contaminants and oxidation layers must be removed, leaving the conductor surface clean.

　　

　　However, some contaminants are strongly bonded to the copper conductor, making it difficult to remove them with weak cleaning agents. Strong alkaline abrasives and brushing are typically used for this treatment. Since the adhesive used in the cover layer is often epoxy-based, which is not resistant to alkaline agents, this can weaken bonding strength. Although not immediately apparent, during the electroplating process, the plating solution may seep into the edges of the cover layer, and in severe cases, cause delamination of the cover layer.

　　

　　At the final soldering stage, solder might seep beneath the cover layer. Therefore, the pre-treatment cleaning process has a significant impact on the basic characteristics of the FPC, making it essential to pay close attention to the processing conditions.

　　

　　2. Thickness of FPC Electroplating

　　

　　The deposition rate of electroplating metal is directly related to the intensity of the electric field, which varies depending on the shape of the circuit and the position of the electrodes. Generally, the thinner the conductor line and the sharper the terminal end, the stronger the electric field, leading to a thicker plating in those areas.

　　

　　In FPC applications, there are often wide differences in the width of conductor lines within the same circuit, resulting in uneven plating thickness. To prevent this, auxiliary cathode patterns are added around the circuit to absorb uneven current distribution across the plating pattern, ensuring uniform plating thickness across all areas.

　　

　　Electrode structure is key here. A compromise approach can be adopted, where stricter standards apply to areas requiring high plating uniformity, such as molten solder (lead-tin) and gold plating for metal wire bonding, while areas requiring plating for general corrosion protection may have more relaxed thickness requirements.

　　

　　FPC manufacturer

　　

　　3. Contamination of FPC Electroplating

　　

　　Immediately after electroplating, the plated surface may appear fine, but stains, dirt, or discoloration can appear over time. Often, these issues are not detected during factory inspections but are discovered during customer acceptance tests. This happens when the plated surface is not adequately rinsed, leaving residual plating solution, which reacts chemically over time, especially on the flexible surface due to its softness and uneven texture.

　　

　　To prevent this, thorough rinsing and drying are essential. A high-temperature thermal aging test can verify whether rinsing was sufficient.

　　

　　FPC Chemical Plating

　　

　　When the conductor to be plated is isolated and cannot serve as an electrode, chemical plating must be used. Chemical plating solutions are highly reactive, and a common example is chemical gold plating. The chemical gold plating solution is an alkaline solution with a very high pH value.

　　

　　When using this process, it is easy for the plating solution to seep beneath the cover layer, especially if the lamination quality control is poor, leading to weak adhesion. Displacement reactions in chemical plating exacerbate this problem, making it difficult to achieve ideal plating conditions.

　　

　　FPC Hot Air Leveling (HASL)

　　

　　Hot air leveling was originally developed for rigid printed circuit boards (PCBs) to coat them with lead-tin. However, this technique has been applied to FPCs due to its simplicity. Hot air leveling involves immersing the board vertically into molten lead-tin and blowing off excess solder with hot air.

　　

　　These conditions are quite harsh for FPCs. Without special measures, FPCs cannot be immersed in molten solder. To address this, FPCs must be clamped between titanium-steel meshes before immersion. Additionally, the surface of the FPC must be cleaned and coated with flux beforehand.

　　

　　Due to the harsh nature of the hot air leveling process, solder may seep beneath the edges of the cover layer, especially if the bonding strength between the cover layer and the copper foil is weak. Since polyimide films are prone to moisture absorption, moisture can evaporate suddenly under the heat, causing blistering or even delamination of the cover layer. Therefore, drying and moisture control must be performed before FPC hot air leveling.

　　

　　FPC manufacturer

　　

　　FPC manufacturer

　　

　　Gekun is a leading manufacturer specializing in high-quality Flexible Printed Circuits (FPC). With years of experience in the industry, Gekun provides advanced FPC solutions tailored to various industries, including telecommunications, medical devices, automotive, and consumer electronics. Their manufacturing process emphasizes precision, reliability, and innovation, ensuring excellent performance and durability. For businesses looking for custom FPC designs or mass production, Gekun stands out as a trusted partner, offering both competitive pricing and cutting-edge technology.

　　

　　For more information on Gekun¨s FPC manufacturing capabilities, you can visit their official website or contact their team for specific inquiries.

Gekun’s Ultra Thin FPC

　　1. Introduction to Ultra-Thin FPCAs a representative of the industry, Flex PCB manufacturer It is necessary to set a certain example for peers and lead the way in product quality. https://gekunflex.com/

　　

　　Flexible Printed Circuits (FPC) are revolutionizing the design of smart devices, offering incredible versatility, lightweight design, and enhanced durability. One of the leading advancements in this field is Gekun¨s Ultra-Thin FPC, an innovative solution tailored for modern smart device applications. This article explores the impact of ultra-thin FPC technology in today¨s tech landscape, particularly within consumer electronics, where devices demand both form and function.

　　

　　Gekun ultra-thin FPC

　　

　　Gekun ultra-thin FPC

　　

　　2. The Importance of FPC in Modern Smart Devices

　　

　　As the demand for lighter, slimmer, and more versatile smart devices grows, FPC technology has emerged as a go-to solution. Offering flexibility and reliability, FPCs are vital for complex circuit layouts within limited spaces. Gekun¨s Ultra-Thin FPC is designed to meet these needs, supporting functions like high-speed data transfer, power efficiency, and adaptability！all essential for the latest technological devices, from smartphones to wearables.

　　

　　3. Key Benefits of Gekun Ultra-Thin FPC

　　

　　The ultra-thin FPC by Gekun provides unique advantages:

　　

　　Space Efficiency: Ultra-thin FPCs take up minimal space, enabling sleeker designs.

　　

　　Enhanced Flexibility: Ideal for curved or folded designs, maximizing functionality in smaller devices.

　　

　　Durability: Withstands wear and tear, essential for portable, frequently used devices.

　　

　　The Gekun ultra-thin FPC is particularly appealing to engineers and designers working on the next generation of smart devices. It not only optimizes internal space but also significantly reduces device weight, which is crucial in today¨s compact tech market.

　　

　　smart device FPC

　　

　　smart device FPC

　　

　　4. Why Choose Gekun for Your Ultra-Thin FPC Needs?

　　

　　Gekun¨s commitment to quality and precision in FPC manufacturing has established it as a trusted name among tech innovators. Gekun Ultra-Thin FPC stands out due to its strict quality control, advanced materials, and cutting-edge manufacturing techniques that align with the latest industry standards. Partnering with Gekun ensures not only high-quality products but also customized solutions tailored to meet unique project needs.

　　

　　5. Gekun Ultra-Thin FPC: Shaping the Future of Smart Devices

　　

　　As technology advances, so does the need for compact, powerful, and resilient components. Gekun¨s Ultra-Thin FPC is a prime example of how innovation in flexible circuits is enhancing the possibilities in smart device design. From the next generation of wearables to foldable displays, the ultra-thin FPC by Gekun will play a pivotal role in transforming user experiences.

　　

　　smart device FPC

　　

　　smart device FPC

　　

　　Conclusion: In today¨s competitive tech environment, Gekun¨s Ultra-Thin FPC delivers unmatched versatility and performance, making it a preferred choice for manufacturers. As demand grows for lightweight, high-functionality components, Gekun remains at the forefront, offering ultra-thin FPC solutions that empower designers and engineers to push the limits of what¨s possible in smart devices.

Introduction

　　This article provides a detailed overview of the key processes and considerations in electroplating, chemical plating, and hot air leveling for Flexible Printed Circuits (FPC). It highlights the importance of pre-treatment in electroplating for maintaining FPC performance, the challenges in controlling plating thickness, and issues related to post-plating stains. Additionally, the article discusses the application of chemical plating when FPC conductors cannot serve as electrodes and the quality concerns that may arise. Finally, it examines the use of hot air leveling on FPCs, focusing on adhesion strength and moisture resistance. Through this article, readers will gain a deeper understanding of the common challenges in FPC manufacturing and their solutions.Today, people are interested in Flex PCB manufacturer There are also many dependencies, and the expectations for products are getting higher and higher. https://gekunflex.com/

　　

　　FPC manufacturer

　　

　　FPC manufacturer

　　

　　FPC Plating Process

　　

　　1. Pre-treatment for FPC Electroplating

　　

　　After the flexible printed circuit (FPC) undergoes the coating process, the exposed copper conductors may be contaminated by adhesives or ink. Additionally, oxidation and discoloration caused by high-temperature processes can occur. To ensure good adhesion of the plating, these contaminants and oxidation layers must be removed, leaving the conductor surface clean.

　　

　　However, some contaminants are strongly bonded to the copper conductor, making it difficult to remove them with weak cleaning agents. Strong alkaline abrasives and brushing are typically used for this treatment. Since the adhesive used in the cover layer is often epoxy-based, which is not resistant to alkaline agents, this can weaken bonding strength. Although not immediately apparent, during the electroplating process, the plating solution may seep into the edges of the cover layer, and in severe cases, cause delamination of the cover layer.

　　

　　At the final soldering stage, solder might seep beneath the cover layer. Therefore, the pre-treatment cleaning process has a significant impact on the basic characteristics of the FPC, making it essential to pay close attention to the processing conditions.

　　

　　2. Thickness of FPC Electroplating

　　

　　The deposition rate of electroplating metal is directly related to the intensity of the electric field, which varies depending on the shape of the circuit and the position of the electrodes. Generally, the thinner the conductor line and the sharper the terminal end, the stronger the electric field, leading to a thicker plating in those areas.

　　

　　In FPC applications, there are often wide differences in the width of conductor lines within the same circuit, resulting in uneven plating thickness. To prevent this, auxiliary cathode patterns are added around the circuit to absorb uneven current distribution across the plating pattern, ensuring uniform plating thickness across all areas.

　　

　　Electrode structure is key here. A compromise approach can be adopted, where stricter standards apply to areas requiring high plating uniformity, such as molten solder (lead-tin) and gold plating for metal wire bonding, while areas requiring plating for general corrosion protection may have more relaxed thickness requirements.

　　

　　FPC manufacturer

　　

　　3. Contamination of FPC Electroplating

　　

　　Immediately after electroplating, the plated surface may appear fine, but stains, dirt, or discoloration can appear over time. Often, these issues are not detected during factory inspections but are discovered during customer acceptance tests. This happens when the plated surface is not adequately rinsed, leaving residual plating solution, which reacts chemically over time, especially on the flexible surface due to its softness and uneven texture.

　　

　　To prevent this, thorough rinsing and drying are essential. A high-temperature thermal aging test can verify whether rinsing was sufficient.

　　

　　FPC Chemical Plating

　　

　　When the conductor to be plated is isolated and cannot serve as an electrode, chemical plating must be used. Chemical plating solutions are highly reactive, and a common example is chemical gold plating. The chemical gold plating solution is an alkaline solution with a very high pH value.

　　

　　When using this process, it is easy for the plating solution to seep beneath the cover layer, especially if the lamination quality control is poor, leading to weak adhesion. Displacement reactions in chemical plating exacerbate this problem, making it difficult to achieve ideal plating conditions.

　　

　　FPC Hot Air Leveling (HASL)

　　

　　Hot air leveling was originally developed for rigid printed circuit boards (PCBs) to coat them with lead-tin. However, this technique has been applied to FPCs due to its simplicity. Hot air leveling involves immersing the board vertically into molten lead-tin and blowing off excess solder with hot air.

　　

　　These conditions are quite harsh for FPCs. Without special measures, FPCs cannot be immersed in molten solder. To address this, FPCs must be clamped between titanium-steel meshes before immersion. Additionally, the surface of the FPC must be cleaned and coated with flux beforehand.

　　

　　Due to the harsh nature of the hot air leveling process, solder may seep beneath the edges of the cover layer, especially if the bonding strength between the cover layer and the copper foil is weak. Since polyimide films are prone to moisture absorption, moisture can evaporate suddenly under the heat, causing blistering or even delamination of the cover layer. Therefore, drying and moisture control must be performed before FPC hot air leveling.

　　

　　FPC manufacturer

　　

　　FPC manufacturer

　　

　　Gekun is a leading manufacturer specializing in high-quality Flexible Printed Circuits (FPC). With years of experience in the industry, Gekun provides advanced FPC solutions tailored to various industries, including telecommunications, medical devices, automotive, and consumer electronics. Their manufacturing process emphasizes precision, reliability, and innovation, ensuring excellent performance and durability. For businesses looking for custom FPC designs or mass production, Gekun stands out as a trusted partner, offering both competitive pricing and cutting-edge technology.

　　

　　For more information on Gekun¨s FPC manufacturing capabilities, you can visit their official website or contact their team for specific inquiries.

Introduction

　　This article provides a detailed overview of the key processes and considerations in electroplating, chemical plating, and hot air leveling for Flexible Printed Circuits (FPC). It highlights the importance of pre-treatment in electroplating for maintaining FPC performance, the challenges in controlling plating thickness, and issues related to post-plating stains. Additionally, the article discusses the application of chemical plating when FPC conductors cannot serve as electrodes and the quality concerns that may arise. Finally, it examines the use of hot air leveling on FPCs, focusing on adhesion strength and moisture resistance. Through this article, readers will gain a deeper understanding of the common challenges in FPC manufacturing and their solutions.Only by working together can we turn Flex PCB manufacturer The value of the play out, the development of the supply market needs. https://gekunflex.com/

　　

　　FPC manufacturer

　　

　　FPC manufacturer

　　

　　FPC Plating Process

　　

　　1. Pre-treatment for FPC Electroplating

　　

　　After the flexible printed circuit (FPC) undergoes the coating process, the exposed copper conductors may be contaminated by adhesives or ink. Additionally, oxidation and discoloration caused by high-temperature processes can occur. To ensure good adhesion of the plating, these contaminants and oxidation layers must be removed, leaving the conductor surface clean.

　　

　　However, some contaminants are strongly bonded to the copper conductor, making it difficult to remove them with weak cleaning agents. Strong alkaline abrasives and brushing are typically used for this treatment. Since the adhesive used in the cover layer is often epoxy-based, which is not resistant to alkaline agents, this can weaken bonding strength. Although not immediately apparent, during the electroplating process, the plating solution may seep into the edges of the cover layer, and in severe cases, cause delamination of the cover layer.

　　

　　At the final soldering stage, solder might seep beneath the cover layer. Therefore, the pre-treatment cleaning process has a significant impact on the basic characteristics of the FPC, making it essential to pay close attention to the processing conditions.

　　

　　2. Thickness of FPC Electroplating

　　

　　The deposition rate of electroplating metal is directly related to the intensity of the electric field, which varies depending on the shape of the circuit and the position of the electrodes. Generally, the thinner the conductor line and the sharper the terminal end, the stronger the electric field, leading to a thicker plating in those areas.

　　

　　In FPC applications, there are often wide differences in the width of conductor lines within the same circuit, resulting in uneven plating thickness. To prevent this, auxiliary cathode patterns are added around the circuit to absorb uneven current distribution across the plating pattern, ensuring uniform plating thickness across all areas.

　　

　　Electrode structure is key here. A compromise approach can be adopted, where stricter standards apply to areas requiring high plating uniformity, such as molten solder (lead-tin) and gold plating for metal wire bonding, while areas requiring plating for general corrosion protection may have more relaxed thickness requirements.

　　

　　FPC manufacturer

　　

　　3. Contamination of FPC Electroplating

　　

　　Immediately after electroplating, the plated surface may appear fine, but stains, dirt, or discoloration can appear over time. Often, these issues are not detected during factory inspections but are discovered during customer acceptance tests. This happens when the plated surface is not adequately rinsed, leaving residual plating solution, which reacts chemically over time, especially on the flexible surface due to its softness and uneven texture.

　　

　　To prevent this, thorough rinsing and drying are essential. A high-temperature thermal aging test can verify whether rinsing was sufficient.

　　

　　FPC Chemical Plating

　　

　　When the conductor to be plated is isolated and cannot serve as an electrode, chemical plating must be used. Chemical plating solutions are highly reactive, and a common example is chemical gold plating. The chemical gold plating solution is an alkaline solution with a very high pH value.

　　

　　When using this process, it is easy for the plating solution to seep beneath the cover layer, especially if the lamination quality control is poor, leading to weak adhesion. Displacement reactions in chemical plating exacerbate this problem, making it difficult to achieve ideal plating conditions.

　　

　　FPC Hot Air Leveling (HASL)

　　

　　Hot air leveling was originally developed for rigid printed circuit boards (PCBs) to coat them with lead-tin. However, this technique has been applied to FPCs due to its simplicity. Hot air leveling involves immersing the board vertically into molten lead-tin and blowing off excess solder with hot air.

　　

　　These conditions are quite harsh for FPCs. Without special measures, FPCs cannot be immersed in molten solder. To address this, FPCs must be clamped between titanium-steel meshes before immersion. Additionally, the surface of the FPC must be cleaned and coated with flux beforehand.

　　

　　Due to the harsh nature of the hot air leveling process, solder may seep beneath the edges of the cover layer, especially if the bonding strength between the cover layer and the copper foil is weak. Since polyimide films are prone to moisture absorption, moisture can evaporate suddenly under the heat, causing blistering or even delamination of the cover layer. Therefore, drying and moisture control must be performed before FPC hot air leveling.

　　

　　FPC manufacturer

　　

　　FPC manufacturer

　　

　　Gekun is a leading manufacturer specializing in high-quality Flexible Printed Circuits (FPC). With years of experience in the industry, Gekun provides advanced FPC solutions tailored to various industries, including telecommunications, medical devices, automotive, and consumer electronics. Their manufacturing process emphasizes precision, reliability, and innovation, ensuring excellent performance and durability. For businesses looking for custom FPC designs or mass production, Gekun stands out as a trusted partner, offering both competitive pricing and cutting-edge technology.

　　

　　For more information on Gekun¨s FPC manufacturing capabilities, you can visit their official website or contact their team for specific inquiries.

In terms of working principle, the light emitting principle is unique

　　In terms of working principle, the light emitting principle is unique: LED (Light Emitting Diode) is a light-emitting diode, and its core is a semiconductor chip. As we all know, wholesale outdoor led display The emergence of the market is worthy of many people’s attention, which has aroused the waves of the whole market. https://ljx-led.com

　　

　　One end of the chip is the negative electrode, and the other end is connected to the positive electrode of the power supply, encapsulated with epoxy resin. When current passes through, electrons and holes are pushed towards the quantum well and recombine, emitting energy in the form of photons, thereby achieving luminescence.

　　

　　Moreover, the wavelength (i.e. color) of light is determined by the material forming the P-N junction, which allows LEDs to achieve a wide range of color variations.

　　

　　Accurate digital signal control: In LED displays, the brightness and color changes of each pixel are controlled by digital signals.

　　

　　Digital signal is a discrete form of signal that encodes various information in binary systems using a combination of “0” and “1”, including text, images, videos, etc.